On May 21, 2026, a group of students from Arizona State University (ASU) – a leading public university in the United States for innovation and
Introduction In the context of the rapidly growing semiconductor industry, the demand for compact, high-performance, and energy-efficient devices is constantly increasing. This has driven the
1. What Are Assembly & Test? (Definitions and Technical Nature) Within the semiconductor value chain, Assembly (packaging) and Test are classified as back-end processes, occurring
On November 13, 2025, CT Semiconductor proudly participated in the Vietnam–Jordan Business Forum held in Hanoi, co-organized by the Vietnam Chamber of Commerce and Industry
In the rapidly evolving semiconductor industry, chip miniaturization and performance optimization are crucial. One packaging technology that meets both demands is the Wafer Level Chip
On November 6, 2025, at the Government Office in Hanoi, Prime Minister Pham Minh Chinh met with the leadership delegation of the Global Semiconductor Industry
