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International Collaboration

Explore opportunities to grow and diversify the global semiconductor ecosystem

Alliance Member

Bring together businesses, academia, users, as well as research and technology organisations who are willing to grow with SATS

Start-up Company

Collaboration in scientific research and support start-up company who are align with OSAT direction, to establish a profitable and sustainable semiconductor ecosystem.

Three Steps To Start OSAT

1. Final Test Service

Semiconductor Final Test, also known as semiconductor device testing or chip testing, is the stage in semiconductor manufacturing where individual semiconductor devices or integrated circuits (ICs) undergo comprehensive testing to ensure they meet the required functional and performance specifications before being packaged and shipped to customers

2. Wafer Probing Service

Semiconductor wafer probing, also known as wafer-level testing or wafer probing, is a critical step in the semiconductor manufacturing process. It involves testing individual semiconductor devices or integrated circuits (ICs) while they are still part of a larger silicon wafer before they are singulated and packaged. Wafer probing is performed to verify the functionality and electrical performance of the devices and to identify any defects or deviations from specifications.

3. Assembly – Packaging Service

Semiconductor assembly and packaging refer to the processes involved in encapsulating individual semiconductor devices or integrated circuits (ICs) into a protective package, which provides electrical connections, mechanical support, and environmental protection. These processes are essential in semiconductor manufacturing to transform bare semiconductor chips into finished products that can be integrated into electronic systems.

Why Final and Wafer Test are the first services to bring up in Vietnam

Market Responsiveness

The Final Test facility enables you to quickly respond to market demands and customer requirements. With a functioning Final Test facility, you can conduct rapid testing of new product designs, prototypes, or custom orders, allowing for faster turnaround times and quicker product delivery to customers. This agility in meeting customer demands can lead to increased sales and revenue opportunities.

Equipment and Infrastructure Requirements

The equipment and infrastructure needed for Semiconductor Final Test and wafer prober are often less complex and costly compared assembly/packaging services. Final test equipment typically involves automated test systems, test handlers, and test sockets, which can be more affordable and readily available compared to specialized wafer probing equipment or complex assembly/packaging machinery. This difference in equipment complexity can result in lower upfront costs for building the Final Test facility

Facility Size and Complexity

The size and complexity of the facility required for Semiconductor Final Test and Wafer Probe are typically smaller compared to the assembly/packaging services. Final and wafer test facilities often require cleanroom environments with controlled air quality and ESD protection, but on a smaller scale compared to the larger cleanrooms needed for wafer probing and assembly/packaging services. The reduced facility size and complexity can lead to lower construction and operational costs for the Final and Probe Test facility

Labor and Workforce Requirements

Semiconductor Final and Probe Test operations generally require a smaller workforce compared to wafer probe and assembly/packaging services. Final test processes are more focused on device testing, data analysis, and quality control, which can be efficiently managed with a smaller team. In contrast, assembly/packaging involve more intricate processes that may require a larger number of skilled technicians and engineers, resulting in higher labor costs

Technology and Complexity

The complexity and sophistication of assembly/packaging processes are typically higher compared to Semiconductor Final and Probe Test. Wafer probing involves precise alignment, probing, and electrical testing of individual integrated circuits on a wafer, requiring specialized equipment and expertise. Assembly and packaging processes involve intricate chip bonding, wire bonding, encapsulation, and testing procedures. The higher technological complexity in wafer probe and assembly/packaging services often translates into higher costs for equipment, materials, and workforce training

Opening a semiconductor assembly and testing house in Vietnam can provide several benefits, including

Vietnam offers lower labor and operating costs compared to other countries such as China, Taiwan, or South Korea, making it an attractive location for semiconductor manufacturing.

Vietnam is strategically located in Southeast Asia, making it a gateway to other fast-growing markets in the region, such as Thailand, Indonesia, and Malaysia.

The Vietnamese government is actively promoting the development of the semiconductor industry, offering incentives and support for foreign investors looking to set up operations in the country.

Vietnam has a young and highly educated workforce, with a strong background in engineering and technology. This makes it an ideal location for high-tech manufacturing and research and development.

Vietnam’s economy is growing rapidly, and there is an increasing demand for high-tech products such as smartphones, tablets, and other electronics. Setting up a semiconductor assembly and testing house in Vietnam can help meet this demand and provide opportunities for growth in the industry.