CT Semiconductor Signs Collaboration Agreement with Can Tho University for Talent Development and IC Packaging Technology

On September 9, 2025, at Can Tho University (CTU), CT Group, Can Tho University, and CT Semiconductor (CTS) officially signed a Memorandum of Agreement (MOA) to strengthen cooperation in talent development and advanced semiconductor packaging technology.
Under this agreement, CTS and CTU will work closely together to bring mutual benefits, while creating opportunities for students, faculty, and young engineers to access the latest innovations in the semiconductor industry. The collaboration focuses on the Project: Training Cooperation in Advanced Semiconductor Packaging, a key area to enhance competitiveness and foster the growth of Vietnam’s semiconductor ecosystem.
The signing ceremony took place in a formal atmosphere with the participation of government representatives, CT Group leadership, CTU executives, and CTS management. This marks an important milestone in fostering collaboration among enterprises, universities, and government bodies, contributing to the sustainable development of Vietnam’s semiconductor industry.

Delegates attending the conference and signing ceremony at Can Tho University

 

CTS, CT Group, and Can Tho University signing the collaboration agreement

 

Representatives of CT Group, CTS, and Can Tho University taking commemorative photos with delegates

Through this partnership, CTS reaffirms its commitment to collaborating with universities in talent development and driving research & innovation in semiconductor packaging, contributing to Vietnam’s ambition of becoming a key player in the global semiconductor value chain.

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