The ATP Semiconductor Chip Technician Training Center

The only place where technicians are trained directly on the most advanced machines in the world.
The only place where you learn directly from foreign lecturers with decades of experience.
The only place where your training is recognized by the National Innovation Center The only place where you get paid before graduation.
The only place where you can continue your studies in Penang, Malaysia, or through the Breakthrough International Cooperation Program at Arizona State University (ASU), USA – the new capital of the semiconductor industry with companies like TSMC, Intel, and Qualcomm.
The only place where you can pursue a Master’s or PhD with sponsorship from CT Group – a pioneer in semiconductors, artificial intelligence, and green technology.
The only place where you can have a stable, long-term career with a salary in the thousands of dollars.

First launch in Vietnam: AMB 5600 – Automated Test Equipment

Program name: TRAINING FOR SEMICONDUCTOR CHIP ASSEMBLY, TEST, AND PACKAGING
Level of education: TECHNICIAN
English title: TRAINING FOR SEMICONDUCTOR CHIP ASSEMBLY, TEST, AND PACKAGING (ATP)
Mode of education: Full-time, formal training
Diploma awarded: Technician

1.1 Training duration: 4 months

1.2 Admission Requirements:

Final-year students majoring in Electrical Engineering, Electronics Engineering, Telecommunications Engineering, Mechatronics Engineering, Control and Automation Engineering, Embedded Systems and IoT, or IC Design Engineering;
Graduates with a degree in Electrical Engineering, Electronics Engineering, Telecommunications Engineering, Mechatronics Engineering, Control and Automation Engineering, Embedded Systems and IoT, or IC Design Engineering.

2.1. Training Goals and Objectives

2.1.1. Training Goals:

Training technicians in semiconductor chip assembly (A), testing (T), and packaging (P) (referred to as ATP), equipping them with strong specialized knowledge

2.1.2 Training Objectives:

Graduates of the Semiconductor Chip Assembly, Test, and Packaging (ATP) program at CT Semiconductor will:

Possess solid expertise in the field of semiconductor chip assembly, testing, and packaging, with the ability to self-train to enhance their professional skills, meet real-world job requirements, and pursue lifelong career development and learning.
Be capable of applying knowledge in the fields of assembly, testing, and packaging of semiconductor chips to effectively operate/evaluate solutions, systems/processes/technical products, and to participate in the design and development of innovative technical solutions for solving practical problems.
Have the ability to think systematically, possess necessary personal qualities and professional skills, and demonstrate the required foreign language proficiency to adapt to international and multicultural work and social environments.
Be able to communicate effectively in professional settings and work well in teams.

2.2. Total Course Credits

2.3 Training Program Structure

No.	Course Code	Course Title	Credits
I. SEMICONDUCTOR CHIP ASSEMBLY (ASSEMBLY)			16
1	EIC1001	Overview of Semiconductor Chip Assembly Process	1
2	EIC1002	Principles of Semiconductor Chip Assembly	2
3	EIC1003	Semiconductor Chip Assembly Process	2
4	EIC1004	Semiconductor Chip Assembly Techniques	2
5	EIC1005	Semiconductor Chip Assembly Requirements	2
6	EIC1006	Quality Management in Semiconductor Chip Assembly	2
7	EIC1007	Hands-on Semiconductor Chip Assembly with Real Machines	5
II. SEMICONDUCTOR CHIP TESTING (TEST)			21
8	EIC2001	Overview of Semiconductor IC Chip Testing Process	1
9	EIC2002	Overview of Automatic Test Equipment (ATE)	1
10	EIC2003	Open and Short Circuit Testing	2
11	EIC2004	Analog and DC Signal Testing	2
12	EIC2005	Digital Signal Testing	2
13	EIC2006	RF Signal Testing	2
14	EIC2007	Automatic Test Equipment	2
15	EIC2008	Mixed-Signal Testing	2
16	EIC2009	Test System Integration	2
17	EIC2010	Hands-on Semiconductor Chip Testing with Real Machines	5
III. SEMICONDUCTOR CHIP PACKAGING (PACKING)			11
18	EIC3001	Overview of Semiconductor Chip Packaging Process	1
19	EIC3002	Chip Packaging Technology	2
20	EIC3003	Hands-on Chip Packaging	5
21	EIC3004	Process Supervision and Management	1
22	EIC3005	Fault Analysis and Quality Control	1
23	EIC3006	Compliance with Industrial Safety Standards	1
TOTAL			48

2.4. Teaching Schedule

JANUARY
No.	Course Code	Course Title	Credits
1	EIC1001	Overview of Semiconductor Chip Assembly Process	1
2	EIC1002	Principles of Semiconductor Chip Assembly	2
3	EIC1003	Semiconductor Chip Assembly Process	2
4	EIC1004	Semiconductor Chip Assembly Techniques	2
5	EIC1005	Semiconductor Chip Assembly Requirements	2
6	EIC1006	Quality Management in Semiconductor Chip Assembly	2
7	EIC2001	Overview of Semiconductor IC Chip Testing Process	1
TOTAL			12
FEBRUARY
No.	Course Code	Course Title	Credits
1	EIC1007	Hands-on Semiconductor Chip Assembly with Real Machines	5
2	EIC2002	Overview of Automatic Test Equipment (ATE)	1
3	EIC2003	Open and Short Circuit Testing	2
4	EIC2004	Analog and DC Signal Testing	2
5	EIC3002	Chip Packaging Technology	2
TOTAL			12
MARCH
No.	Course Code	Course Title	Credits
1	EIC2005	Digital Signal Testing	2
2	EIC2006	RF Signal Testing	2
3	EIC2007	Automatic Test Equipment	2
4	EIC2008	Mixed-Signal Testing	2
5	EIC2009	Test System Integration	2
6	EIC3001	Overview of Semiconductor Chip Packaging Process	1
7	EIC3004	Process Supervision and Management	1
TOTAL			12
APRIL
No.	Course Code	Course Title	Credits
1	EIC2010	Hands-on Semiconductor Chip Testing with Real Machines	5
2	EIC3005	Fault Analysis and Quality Control	1
3	EIC3006	Compliance with Industrial Safety Standards	1
4	EIC3003	Hands-on Chip Packaging	5
TOTAL			12
TOTAL CREDITS OF TRAINING PROGRAM			48

CT SEMICONDUCTOR